To provide a semiconductor device and a semiconductor manufacturing method which can achieve excellent conjunction between semiconductor devices or with a substrate and have excellent manufacturing stability.

A semiconductor device 1 comprises: a semiconductor substrate 11; and a conductor post part 121 protruding from the semiconductor substrate 11. The conductor post part 121 is provided on the semiconductor substrate 11 without forming a depression hollowing in a direction crossing a protruding direction of the conductor post part 121 on an outer face extending from a tip to a base on the semiconductor substrate 11 side.