To make it possible to automatically position the test head for a wafer prober, and to improve the accuracy of positioning.

This semiconductor measuring device is provided with a wafer prober 5 with which an external signal line is electrically connected to each electrode of a semiconductor chip, a tester 1 which is electrically connected to the wafer prober 5 through the external signal line and performs an electric characteristic test on the semiconductor chip, a test head 3 supported by a tester 1 in a freely movable manner and positioned on the prescribed position of the wafer prober 5 and used to electrically connect the external signal line which is electrically connected to each electrode of the semiconductor chip and the tester 1, a driving means which drives the tester heat 3, a control driver 51, a servo motor which is built-in in the tester 1, a light emitting part 21 and a light receiving part 11 used as a relative position detecting means which detects the mutual position of the test head 3 and the wafer prober 5, and a control device 41 which performs the shifting positioning of the test head 3 to the prober 5 based on the result of testing.