Title:
半導体モジュール
Document Type and Number:
Japanese Patent JP5838759
Kind Code:
B2
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Inventors:
Shinichi Miura
Application Number:
JP2011258043A
Publication Date:
January 06, 2016
Filing Date:
November 25, 2011
Export Citation:
Assignee:
TOYOTA JIDOSHA KABUSHIKI KAISHA
International Classes:
H01L23/40; H01L23/473; H05K7/20
Domestic Patent References:
| JP2009182313A | ||||
| JP2005228877A | ||||
| JP2011181687A |
Attorney, Agent or Firm:
Kaiyu International Patent Office