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Title:
SEMICONDUCTOR OPTICAL ELEMENT, AND METHOD OF MANUFACTURING THE SAME
Document Type and Number:
Japanese Patent JP2010263047
Kind Code:
A
Abstract:

To reduce damage on an end face upon cleaving a semiconductor substrate and handling after the cleavage, in a semiconductor optical element including a film on the end face of an optical waveguide and a method of manufacturing the semiconductor optical element.

A semiconductor optical element 1 includes: an optical waveguide 2 disposed on a semiconductor substrate 3 and extending in an optical waveguide direction along a principal surface 3a of the semiconductor substrate 3; end faces 2a and 2b formed at both ends of the optical waveguide 2; cleavage planes 3c and 3d formed at both ends of the semiconductor substrate 3 in the optical wave guiding direction; and films 10a and 10b disposed on both end faces 2a and 2b of the optical waveguide 2 and having a refractive index smaller than that of the optical waveguide 2. The films 10a and 10b are formed before the cleavage of the semiconductor substrate 3.

COPYRIGHT: (C)2011,JPO&INPIT


Inventors:
FUKUDA CHIE
Application Number:
JP2009112213A
Publication Date:
November 18, 2010
Filing Date:
May 01, 2009
Export Citation:
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Assignee:
SUMITOMO ELECTRIC INDUSTRIES
International Classes:
H01S5/028; G02F1/025; H01S5/12
Attorney, Agent or Firm:
Yoshiki Hasegawa
Shiro Terasaki
Yoshiki Kuroki
Ichira Kondo