To provide a more inexpensive highly reliable self-aligning contact point at the end part of each transfer line, by providing a flat surface including a semiconductor and an insulating material, a metal-lead extending part, which is not higher than the surface, and self-aligning incomplete conductor in contact with a lead insulated from the semiconductor by the insulating material.
After a plating stage, a polyimide layer 46 is polished and flattened by the method such as chemical-mechanical polishing. An upper end 48 of an extending part 42 is exposed. A T-type connecting pad 50 made of metal is formed. Then, photoresist is removed, and the T-type connecting pat 50 is made to remain. The side surface of a laminated layer has the transfer metal line of large column, a self-aligning extending part 42 and the T-type connecting pat 50. Since the T-type connecting pat is large, the single exposing stage for the entire laminated layer is adequate for contact with all upper ends 48 of the extending part 42 on the laminated layer in this stage. Thus, the problems of the fluctuations of core adjustment and the thickness caused by the contact of the column of the extending part of the transfer metal line to the side surface are eliminated.
TOOMASU JII FUERENSU
UEIN JIEI HAUERU
