To provide a semiconductor test apparatus at a low cost capable of properly evaluating a semiconductor at a temperature of about 400 °C such as an EM evaluation.

Through-holes for exposing pads of each of dies of a semiconductor wafer 5 in a state that the semiconductor wafer 5 is mounted on a measurement substrate 1 are formed to the measurement substrate 1, the semiconductor wafer 5 is supported on one side of the substrate 1 by a wafer holder 12, a wire pattern used for transmitting evaluation test signals to the supported semiconductor wafer 5 is formed to the other side of the board, in a state that the pads of each die and pads of the wire pattern are wire-bonded through the through-holes, the measurement substrate 1 is set at the evaluation test so that the semiconductor wafer mount part of the substrate 1 is placed inside a high temperature oven 101 and terminal parts to which the evaluation test signals are applied are located outside the temperature oven 101.