To provide a method for manufacturing a circuit board in which a straight via hole process is performed without the occurrence of a compression in a composite sheet material, a flash does not occur, a conductive resin paste is easily filled and a via connection with a good connection quality is obtained, and also to provide a method for manufacturing a part built-in module using the same.
In the method for manufacturing the circuit board after protection films (2a, 2c) are laminated on both faces of an electric insulating matrix (1), a via hole (204) process is performed at a desired location, and a conductive paste is filled therein. After the protection films (2a, 2c) are exfoliated, electrode patterns are disposed and formed on upper and lower faces of the electric insulating matrix (1). On at least one face of the protection films (2a, 2c), a boring (80) or a perforation has been in advance performed at a location corresponding to a position of the via hole (204) process, and after laminated on the electric insulating matrix (1), the boring is performed by punchings (71, 72).
HAYASHI YOSHITAKE
MATSUOKA SUSUMU
YUHAKU SEI
Next Patent: SEMICONDUCTOR TEST APPARATUS AND SEMICONDUCTOR TEST METHOD