Title:
半導体ユニット及び半導体装置
Document Type and Number:
Japanese Patent JP7448038
Kind Code:
B2
Abstract:
A semiconductor unit includes a plurality of semiconductor chips, and an insulated circuit board including an insulating plate having, in a plan view of the semiconductor unit, a rectangular shape surrounded by first and second sides opposite to each other and third and fourth sides perpendicular to the first and second sides and opposite to each other, an output circuit pattern and an input circuit pattern on a front surface of the insulating plate. The output and input circuit patterns each extend from the third side to the fourth side, and disposed in this order side by side in a main current direction that is a direction from the first side toward the second side. The plurality of semiconductor chips are bonded to the input circuit pattern at an area extending from the third side to the fourth side and including a center of the third and fourth sides.
Inventors:
Taichi Ito
Application Number:
JP2022571927A
Publication Date:
March 12, 2024
Filing Date:
November 01, 2021
Export Citation:
Assignee:
Fuji Electric Co., Ltd.
International Classes:
H01L25/07; H01L23/12; H01L25/18
Domestic Patent References:
| JP2012186910A | ||||
| JP2009284604A | ||||
| JP8078620A | ||||
| JP2003142689A |
Foreign References:
| WO2018056213A1 | ||||
| WO2013002249A1 |
Attorney, Agent or Firm:
Patent Attorney Corporation Fuso International Patent Office