SHEETLIKE SUBSTANCE FOR HEAT CONDUCTIVE SUBSTRATE, ITS MANUFACTURE, HEAT CONDUCTIVE SUBSTRATE USING IT AND ITS MANUFACTURE

Japanese Patent JP3312723

B2

PROBLEM TO BE SOLVED: To obtain a sheetlike substance into which an inorganic filler can be filled at high concentration by a method wherein a mixture sheet is provided with flexibility in a semihardened or partially hardened state.
SOLUTION: In a heat conductive sheetlike substance 100, a film is formed on a mold-releasing film 101. In its formation method, a mixture slurry which is composed of at least an inorganic filler, of a thermosetting rein composition, of a solvent having a boiling point of 150°C or higher and of a solvent having a boiling point of 100°C or lower is prepared, and a film is formed on the mold-releasing film 101. As a film formation method, an existing doctor blade method, an existing coater method and an extrusion molding method can be used. Then, when the solvent having the boiling point of 100°C or lower in the slurry used to form the film is dried, the heat conductive sheetlike substance 100 which is flexible can be obtained. The heat conductive substrate obtained by hardening the heat conductive sheetlike substance 100 so as to be used as a substrate body can be provided with a coefficient of thermal expansion nearly similar to that of a semiconductor because the inorganic filler in a large quantity can be filled. In addition, the heat-dissipating property of the substrate is excellent.

Seiichi Nakatani
Hiroyuki Handa

JP27000597A

August 12, 2002

October 02, 1997

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Matsushita Electric Industrial Co., Ltd

C08J5/18; C08K3/00; C08K3/22; C08K5/05; C08K5/10; C08L63/00; C08L101/00; H01L23/12; H01L23/14; H01L23/28; H05K1/03; H05K1/11; H05K3/46; H05K3/00; (IPC1-7): H01L23/14; H01L23/28; H05K1/03

JP4340258A
JP644824A

Hiroyuki Ikeuchi (1 person outside)

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