Title:
銀化合物被覆銀粉及びその製造方法
Document Type and Number:
Japanese Patent JP4583063
Kind Code:
B2
Abstract:
The objects of the present invention are to provide silver compound-coated silver powder applicable to a conductive paste for forming conductive interconnections for an electronic circuit by the silver powder coated with a silver compound which is thermally decomposed at lower temperature than a melting point of silver, and also to provide a method for producing the same. The means for achieving the objects involves thermal decomposition of the silver compound which is decomposed at much lower temperature than a melting point of silver to fuse silver compound-coated silver particles to each other by silver from the silver compound during sintering of a substrate on which electronic circuit conductive interconnections are to be formed by the conductive paste which contains the silver compound-coated silver powder containing the silver compound-coated silver particles inwhich the silver particles are coated with the silver compound.
Inventors:
Takuya Sasaki
Takahiko Sakagami
Fujimoto Taku
Katsuhiko Yoshimaru
Takahiko Sakagami
Fujimoto Taku
Katsuhiko Yoshimaru
Application Number:
JP2004119211A
Publication Date:
November 17, 2010
Filing Date:
April 14, 2004
Export Citation:
Assignee:
Mitsui Mining & Smelting Co., Ltd.
International Classes:
C08K9/00; B22F1/16; C08L101/00; C23C22/06; C23C24/10; C23C26/00; C23C26/02; H01B1/02; H01B1/22; H01B5/00; H05K1/09; H05K3/40
Domestic Patent References:
| JP2002220602A | ||||
| JP2000219901A |
Attorney, Agent or Firm:
Katsuhiro Yoshimura