Title:
SOLDER ALLOY, SOLDER PASTE, SOLDER BALL, SOLDER PREFORM AND SOLDER JOINT
Document Type and Number:
Japanese Patent JP2021037546
Kind Code:
A
Abstract:
To provide a solder alloy which exhibits excellent temperature cycle characteristics, suppresses yellowing, maintains excellent wettability and can suppress an increase over time in the viscosity of a solder paste; and a solder paste, a solder ball, and a solder joint that are obtained using this solder alloy.SOLUTION: The solder alloy contains, in terms of mass%, 1.0 to 5.0% of Ag, 0.5 to 3.0% of Cu, 0.5 to 7.0% of Sb, 0.0040 to 0.025% of As, with the remainder consisting of Sn.SELECTED DRAWING: Figure 1
Inventors:
KAWASAKI HIROYOSHI
SHIRATORI MASATO
KAWAMATA YUJI
SHIRATORI MASATO
KAWAMATA YUJI
Application Number:
JP2020193911A
Publication Date:
March 11, 2021
Filing Date:
November 20, 2020
Export Citation:
Assignee:
SENJU METAL INDUSTRY CO
International Classes:
B23K35/26; C22C13/00; C22C13/02
Attorney, Agent or Firm:
Hideki
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