SOLDER ALLOY, SOLDER PASTE, SOLDER BALL, SOLDER PREFORM, SOLDER JOINT, ONBOARD ELECTRONIC CIRCUIT, ECU ELECTRONIC CIRCUIT, ONBOARD ELECTRONIC CIRCUIT DEVICE, AND ECU ELECTRONIC CIRCUIT DEVICE

Title:

SOLDER ALLOY, SOLDER PASTE, SOLDER BALL, SOLDER PREFORM, SOLDER JOINT, ONBOARD ELECTRONIC CIRCUIT, ECU ELECTRONIC CIRCUIT, ONBOARD ELECTRONIC CIRCUIT DEVICE, AND ECU ELECTRONIC CIRCUIT DEVICE

Document Type and Number:

Japanese Patent JP2021037547

Kind Code:

A

Abstract:

To provide a solder alloy that has not only a long-term ability to withstand severe temperature cycle properties such as low temperatures of -40°C and high temperatures of 125°C, but also a long-term ability to withstand force from the exterior produced by running up onto the curb, colliding with a car in front, or the like and, furthermore, can suppress changes over time in the viscosity of a solder paste; and provide a solder paste, a solder ball, and a solder preform that are made using this solder alloy, as well as a solder joint formed thereby, and an onboard electronic circuit, an ECU electronic circuit, an onboard electronic circuit device, and an ECU electronic circuit device that are provided with this solder joint.SOLUTION: The solder alloy contains, in terms of mass%: 1-4% of Ag; 0.5-1.0% of Cu; 1.5-5.5% of Bi and 1.0-5.3% of Sb, or over 5.5% and no greater than 7.0% of Bi and 2.0-5.3% of Sb; 0.01-0.2% of Ni; and 0.0040-0.0250% of As, with the remainder consisting of Sn.SELECTED DRAWING: Figure 1

Inventors:

KAWASAKI HIROYOSHI
SHIRATORI MASATO
KAWAMATA YUJI

Application Number:

JP2020193913A

Publication Date:

March 11, 2021

Filing Date:

November 20, 2020

Export Citation:

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Assignee:

SENJU METAL INDUSTRY CO

International Classes:

B23K35/26; B23K35/14; B23K35/22; C22C13/00; C22C13/02; H05K3/34

Attorney, Agent or Firm:

Hideki

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