Title:
SOLDER ALLOY, SOLDER POWDER, AND SOLDER JOINT
Document Type and Number:
Japanese Patent JP2020192601
Kind Code:
A
Abstract:
To provide a solder alloy and the like which suppress changes with time of a solder paste, have a small temperature difference between a liquidus line temperature and a solidus line temperature, and have high reliability.SOLUTION: A solder alloy has an alloy composition of at least one of 10 mass ppm or more and less than 40 mass ppm As, 0-10,000 mass ppm Bi, 0-5,100 mass ppm Pb, and 0-3,000 mass ppm of Sb, and the balance Sn, and satisfies Expression (1): 300≤3As+Sb+Bi+Pb and Expression (2): 0.1≤{(3As+Sb)/(Bi+Pb)}×100≤200, in Expressions (1) and (2), As, Sb, Bi and Pb each satisfy a content (mass ppm) in the alloy composition.SELECTED DRAWING: None
Inventors:
KAWASAKI HIROYOSHI
MUNAKATA OSAMU
SHIRATORI MASATO
MUNAKATA OSAMU
SHIRATORI MASATO
Application Number:
JP2019238024A
Publication Date:
December 03, 2020
Filing Date:
December 27, 2019
Export Citation:
Assignee:
SENJU METAL INDUSTRY CO
International Classes:
B23K35/26; C22C13/00; C22C13/02
Attorney, Agent or Firm:
Hideki