Title:
SOLDER ALLOY, SOLDER POWDER, SOLDER PASTE, SOLDER BALL, SOLDER PREFORM, AND SOLDER JOINT
Document Type and Number:
Japanese Patent JP2020192604
Kind Code:
A
Abstract:
To provide: a solder alloy which suppresses corrosion of Fe in a solder bath, exhibits high mechanical strength in a solder joint and does not cause short-circuits in circuits; and a solder powder, a solder paste, a solder ball, a solder preform and a solder joint that are obtained using this solder alloy.SOLUTION: This solder alloy has an alloy composition that contains, in terms of mass%, 0.55-0.75% of Cu, 0.0350-0.0600% of Ni, 0.0035-0.0200% of Ge, and 0.0020-0.0100% of Fe, with the remainder being Sn.SELECTED DRAWING: Figure 1
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Inventors:
KAWASAKI HIROYOSHI
MUNAKATA OSAMU
SHIRATORI MASATO
MUNAKATA OSAMU
SHIRATORI MASATO
Application Number:
JP2020028016A
Publication Date:
December 03, 2020
Filing Date:
February 21, 2020
Export Citation:
Assignee:
SENJU METAL INDUSTRY CO
International Classes:
B23K35/26; B23K35/22; B23K35/363; C22C13/00
Attorney, Agent or Firm:
Hideki