Title:
半田合金及び半田粉
Document Type and Number:
Japanese Patent JP6829272
Kind Code:
B2
Abstract:
To provide new solder alloy for manufacturing a solder paste, the solder alloy capable of suppressing viscosity increase after paste production.SOLUTION: A solder alloy contains Sn and one or two or more kinds selected from the group consisting of Ag, Bi, Sb, Zn, In and Cu, and contains As of 20 ppm to 100 ppm.SELECTED DRAWING: None
Inventors:
Yoshiaki Uezumi
Keigo Gyoda
Keigo Gyoda
Application Number:
JP2019012696A
Publication Date:
February 10, 2021
Filing Date:
January 29, 2019
Export Citation:
Assignee:
Mitsui Mining & Smelting Co., Ltd.
International Classes:
B23K35/26; B23K35/22; C22C13/00
Domestic Patent References:
| JP6717559B2 | ||||
| JP2002224881A | ||||
| JP2006181636A | ||||
| JP2013184169A | ||||
| JP2010229501A |
Foreign References:
| CN101579790A | ||||
| CN1712175A | ||||
| US6253988 |
Attorney, Agent or Firm:
Takeuchi/Ichizawa International Patent Office