Title:
はんだ合金
Document Type and Number:
Japanese Patent JP6836040
Kind Code:
B1
Abstract:
【課題】優れた耐クリープ特性を有し、かつ、良好な加工性を有するはんだ合金を提供する。【解決手段】はんだ合金は、質量％で、Ａｇ：０〜４％、Ｃｕ：０．１〜１．０％、Ｎｉ：０．０１〜０．３％、Ｓｂ：５．１〜７．５％、Ｂｉ：０．１〜４．５％、Ｃｏ：０．００１〜０．３％、Ｐ：０．００１〜０．２％、および、残部がＳｎからなる合金組成を有する。【選択図】なし
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Inventors:
Yuki Iijima
Yoshikawa Shunsaku
Mt Saito
Yoshikawa Shunsaku
Mt Saito
Application Number:
JP2020130472A
Publication Date:
February 24, 2021
Filing Date:
July 31, 2020
Export Citation:
Assignee:
Senju Metal Industry Co., Ltd.
International Classes:
B23K35/26; B23K35/14; B23K35/22; C22C13/02
Domestic Patent References:
| JP6192797A | ||||
| JP2006524572A | ||||
| JP201883211A | ||||
| JP6624322B1 |
Foreign References:
| WO2019053866A1 |
Attorney, Agent or Firm:
Umeda Shinsuke
Hiroyuki Ohno
Hiroshi Nomoto
Hiroyuki Ohno
Hiroshi Nomoto