LEAD-FREE SOLDERING METHOD AND SOLDERED ARTICLE

WIPO Patent Application WO/2016/059744

A1

Prevention of the occurrence of voids and solder wettability are improved in a method for soldering an Ag-containing lead-freed solder to be soldered to an Ag-containing member. A method for soldering an Ag-containing lead-freed solder according to the present invention comprises: a first step wherein an Ag-containing member and a lead-free solder, which has a composition containing Ag such that the relationship between the Ag concentration C (mass %) contained in a mass M (g) of an Sn-Ag based lead-free solder before soldering and the elution amount B (g) of the Ag contained in the Ag-containing member satisfies 1.0 mass % ≤ (M × C + B) × 100/(M + B) ≤ 4.6 mass %, with the balance made up of Sn and unavoidable impurities, are brought into contact with each other; a second step wherein the lead-free solder is heated and melted; and a third step wherein the lead-free solder is cooled.

WO/2008/148986	IMPROVED ATMOSPHERIC-PRESSURE ALUMINIUM BRAZING METHOD
JP3752830	Joined metal member and method of joining the member
JPH09510663	Equipment for enforcing how to join an aluminium component by brazing, the usage of this method, and this method

WATANABE HIROHIKO (JP)
SAITO SHUNSUKE (JP)
ONO MASAHIRO (JP)
WATANABE TAKASHI (JP)
SANO SHINJI (JP)
ONISHI KAZUNAGA (JP)

PCT/JP2015/004289

April 21, 2016

August 26, 2015

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FUJI ELECTRIC CO LTD (JP)

B23K1/19; B23K1/00; B23K35/26; C22C13/02; H01L21/52; H01L23/40; H01L25/07; H01L25/18; H05K3/34; B23K101/40; B23K101/42

JP2002217434A	2002-08-02
US20030132271A1	2003-07-17

HIROSE, Hajime et al. (JP)
Hirose 1 (JP)

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