Title:
SOLDER LAND FOR TUBE-TYPE CHIP PART
Document Type and Number:
Japanese Patent JPH08125318
Kind Code:
A
Abstract:
PURPOSE: To prevent Manhattan phenomenon of a tube-type chip part without damaging reliability of soldering.
CONSTITUTION: A distance between both land bodies 15 is made at most half a length of a part body 13 of a tube-type chip part 12. Therefore, a moment based on surface tension of a part of molten solder 16 below an electrode part 14 is larger than a moment based on surface tension of a part of the molten solder 16 outside the tube-type chip part 12. Generation of Manhattan phenomenon of the tube-type chip part 12 is prevented in this way.
Inventors:
MAENO KAZUTO
Application Number:
JP25531894A
Publication Date:
May 17, 1996
Filing Date:
October 20, 1994
Export Citation:
Assignee:
SUMITOMO WIRING SYSTEMS
International Classes:
H05K3/34; H05K1/11; (IPC1-7): H05K3/34
Attorney, Agent or Firm:
Shigeaki Yoshida (2 outside)