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Patent Searching and Data


Title:
SOLDERLESS WIRING BOARD
Document Type and Number:
Japanese Patent JPH08125317
Kind Code:
A
Abstract:

PURPOSE: To provide a relatively economical wiring board wherein a part can be connected to a through-hole without soldering, a part can be exchanged readily and a part mounting height is not so large.

CONSTITUTION: Insulation substrates 7, 8 with lead terminal insertion holes 7a, 8a in a position opposite to a through-hole 2 are laminated up and down a wiring substrate 1 with the through-hole 2. A lamination body 21 formed as above is held between frame bodies 9 and the wiring substrate 1 and the insulation substrates 7, 8 are held to freely slide each other. By the sliding, while a lead terminal 3a inserted to the through-hole 2 of the lamination body 21 and a lead terminal insertion hole 7a up and down thereof are in pressure contact with an inner circumferential surface of the through-hole 2, the wiring substrate 1 and the insulation substrates 7, 8 are locked by a screw-type lock means 10. A screw hole of a frame body which fits to a screw 10a of the lock means 10 is a round hole. Among an insulation substrate and a wiring substrate, one which is slid has a long hole and the other has a round hole.


Inventors:
FUKUDA TAKESHI
JOSA KOICHI
KATSUKI AKIHIRO
Application Number:
JP25555994A
Publication Date:
May 17, 1996
Filing Date:
October 20, 1994
Export Citation:
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Assignee:
JAPAN AVIATION ELECTRON
International Classes:
H05K3/32; H05K3/30; (IPC1-7): H05K3/32
Attorney, Agent or Firm:
Kusano Taku (1 person outside)