Title:
SOLDER PASTE COMPOSITION
Document Type and Number:
Japanese Patent JP2010269356
Kind Code:
A
Abstract:
To provide a solder paste composition which can achieve an extremely high level of printability and bleeding suppression effect (even after continuous printing) without causing degradation of stability during storage and solder bonding failure.
The solder paste composition is characterized by containing solder alloy powder, thermoplastic resin powder with a lower melting temperature than the solder alloy and flux. The solder paste composite is effective in bringing the extremely high level of printability and bleeding suppression effect during continuous printing, without causing the degradation of stability during storage, the solder bonding failure, and rejection at an appearance inspection.
Inventors:
SAKOTA NAOKI
AIHARA MASAMI
KASHIWAGI SHINICHIRO
AIHARA MASAMI
KASHIWAGI SHINICHIRO
Application Number:
JP2009124606A
Publication Date:
December 02, 2010
Filing Date:
May 22, 2009
Export Citation:
Assignee:
SHARP KK
HARIMA CHEMICALS INC
HARIMA CHEMICALS INC
International Classes:
B23K35/363; B23K35/14; B23K35/22; H05K3/34; B23K35/26; C22C11/06; C22C12/00; C22C13/00
Domestic Patent References:
| JP2008110380A | 2008-05-15 | |||
| JP2003264367A | 2003-09-19 | |||
| JP2008110379A | 2008-05-15 | |||
| JP2004230426A | 2004-08-19 |
Attorney, Agent or Firm:
Keiichiro Saikyo
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