Title:
SOLDER PASTE AND MOUNTING STRUCTURE
Document Type and Number:
Japanese Patent JP2021070057
Kind Code:
A
Abstract:
To provide a solder paste containing a flux component which has good physical property during storage and soldering.SOLUTION: A solder paste contains solder powder, and a flux component containing a compound having at least one carboxyl group protected with a trialkylsilyl group. The solder paste further contains a thermosetting resin, and the carboxyl group of the compound is derived from any one or both of an aliphatic carboxylic acid and an aromatic carboxylic acid.SELECTED DRAWING: Figure 1
Inventors:
OHASHI NAOMICHI
MATSUNO KOSO
OKAWA YASUHIRO
MATSUNO KOSO
OKAWA YASUHIRO
Application Number:
JP2019199966A
Publication Date:
May 06, 2021
Filing Date:
November 01, 2019
Export Citation:
Assignee:
PANASONIC IP MAN CORP
International Classes:
B23K35/363; B23K35/26; C22C12/00; C22C13/00; C22C13/02; C22C28/00; H05K3/34
Attorney, Agent or Firm:
Michiko Matsutani
Yoshida Tamaki
Yoshida Tamaki