Title:
はんだペースト、はんだ合金粉
Document Type and Number:
Japanese Patent JP6828880
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a solder paste capable of performing solder joining at a comparatively low reflow temperature in a solder paste using solder alloy powders containing Sb.SOLUTION: In a solder paste made by mixing solder alloy powders and a flux, the solder alloy powders include first solder alloy powders and second solder alloy powders having different compositions, the first solder alloy powders contain 0.1 mass% or more and 4.0 mass% or less Ag, 0.1 mass% or more and 0.8 mass% or less Cu, 0 mass% or more and 6.0 mass% or less Bi, 0 mass% or more and 2.5 mass% or less Sb and the balance Sn, and the second solder alloy powders contain 0.1 mass% or more and 4.0 mass% or less Ag, 0.1 mass% or more and 0.8 mass% or less Cu, 0 mass% or more and 6.0 mass% or less Bi, more than 2.5 mass% and 16 mass% or less Sb and the balance Sn, and the content of Bi in the second solder alloy powders is equal to or less than the content of Bi in the first solder alloy powders.SELECTED DRAWING: None
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Inventors:
Go Wada
Kimiyuki Mori
Seiji Tsuchiya
Mitsuo Yamashita
Kimiyuki Mori
Seiji Tsuchiya
Mitsuo Yamashita
Application Number:
JP2016198280A
Publication Date:
February 10, 2021
Filing Date:
October 06, 2016
Export Citation:
Assignee:
Hiroki Co., Ltd.
International Classes:
B23K35/22; B23K35/26; C22C13/00; C22C13/02
Domestic Patent References:
| JP2016047555A | ||||
| JP2011056527A | ||||
| JP2002001573A |
Attorney, Agent or Firm:
Noboru Fujimoto
Hiroaki Nakatani
Hiroaki Nakatani