Title:
SOLDER WITH METALLIC WIRE INCLUDED
Document Type and Number:
Japanese Patent JP2663916
Kind Code:
B2
Abstract:
PURPOSE: To simply and cleanly perform, without a skilled worker, a soldering operation in which an electrical and mechanical connection are carried out on an electric signal wire such as a metallic lead wire or a metallic pin in the assembly of electronic equipment.
CONSTITUTION: Solder 1 with a metallic wire included is a solder 10 in which a metallic wire 11 with a melting point higher than the solder 10 is perliminarily included and fixed. Metallic lead wires 2, 3, objects to be connected, are temporarily fixed in a desired positional relation by means of the solder 1 with a metallic wire included, and then, the solder 10 is heated, melted and cooled, joining the metallic lead wires 2, 3. With this heating, the solder 10 is melted and liquefied, but the metallic wire 11 with a higher melting point remains solid, providing an unchanged force for fixing the metallic lead wires 2, 3. Consequently, the objects are joined with the positional relation retained as temporarily fixed.
Inventors:
ZAITSU MAKOTO
Application Number:
JP14902395A
Publication Date:
October 15, 1997
Filing Date:
June 15, 1995
Export Citation:
Assignee:
NIPPON DENKI KK
International Classes:
B23K33/00; B23K35/14; (IPC1-7): B23K35/14
Domestic Patent References:
| JP62220269A | ||||
| JP5239555A | ||||
| JP69783U | ||||
| JP6292092U | ||||
| JP6080088U | ||||
| JP58189093U |
Attorney, Agent or Firm:
Yutaro Kumagai