To obtain a soldering device equipped with a bar solder feeding device capable of feeding into a solder bath a bar solder, as is delivered from a solder manufacturer, in the original size without any processing.
This soldering device 1 is constituted of a solder bath 10 and a bar solder feeding device 20; the feeding device 20 is so structured that a bar solder S is supplied into a solder bath 10 by being vertically held and retained with a pair of transporting belts 24, 25 which are parallelly arranged with a prescribed space apart in the width direction, and that the transporting belt 25 is adjustable in the space in the width direction by being moved forwards and backwards against the transporting belt 24 by means of a bar solder fine adjusting device 27.