Title:
SOLDERLESS CONNECTION
Document Type and Number:
Japanese Patent JP2012080051
Kind Code:
A
Abstract:
To solve the problem that there is no inexpensive method with reliability against vibration though solder is often used for connection between a printed circuit board and a terminal in a conventional manner, but a solderless way is desired since the solder is not good for the environment.
A shape in a portion for soldering between a normal printed circuit board and a terminal is changed into a shape for edging. Thus, reliability against vibration is improved inexpensively.
Inventors:
YAGI TAKAO
Application Number:
JP2010235896A
Publication Date:
April 19, 2012
Filing Date:
September 30, 2010
Export Citation:
Assignee:
MATSUDADENKI CO LTD
International Classes:
H05K3/32
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