Title:
SOLID-STATE IMAGE SENSING DEVICE
Document Type and Number:
Japanese Patent JPH06112249
Kind Code:
A
Abstract:
PURPOSE: To reduce a flare without a danger that an edge short circuit is caused in a solid-state image sensing device wherein an electrode for a solid-state image sensing element is taken out via a wire.
CONSTITUTION: Each corner part at a solid-state image sensing element 1 is chamfered 6 in such a way that each rise height (a) of each wire 5 is set at 100μm or lower and that an interval (b) in the up-and-down direction between a wire arch and a chip edge at the solid-state image sensing element is set at 50μm or higher.
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Inventors:
SAWADA NAOKI
Application Number:
JP28075992A
Publication Date:
April 22, 1994
Filing Date:
September 25, 1992
Export Citation:
Assignee:
SONY CORP
International Classes:
H01L21/60; H01L27/14; (IPC1-7): H01L21/60; H01L27/14
Attorney, Agent or Firm:
Hideaki Ogawa