Title:
SOUND INSULATING METHOD OF ULTRASONIC SENSOR AND SOUND INSULATING MATERIAL BASED UPON THE SAME
Document Type and Number:
Japanese Patent JP3167175
Kind Code:
B2
Abstract:
PURPOSE: To obtain the sound insulating method of the ultrasonic sensor which provides sufficient sound insulation performance even under high pressure with simple constitution.
CONSTITUTION: This method provides sound insulation for the reverse surface of the ultrasonic sensor, and a multi-layered structure body consisting of different kind of media 13, 14, and 15 which deform small against pressure and differ in acoustic impedance is arranged on the reverse surface of an ultrasonic vibrator 12 and insulates an ultrasonic wave traveling to the reverse surface. The array intervals α2, α3, and α4 of the different kind of media 13, 14, and 15 of the multi-layered structure body are so determined that a transmitted wave from the outermost layer has less than a desired value by utilizing the transmission theory of a sound wave in the multi-layered media; and the interval α1 between the multi-layered structure body and ultrasonic vibrator is so set that impedance characteristics of the ultrasonic wave do not vary owing to resonance.
Inventors:
Norio Matsuhiro
Shinji Ogawa
Shinji Ogawa
Application Number:
JP11698492A
Publication Date:
May 21, 2001
Filing Date:
April 08, 1992
Export Citation:
Assignee:
FURUNO ELECTRIC COMPANY,LIMITED
International Classes:
G01B17/00; G01N29/24; G01S7/52; G01S7/521; H04R1/00; (IPC1-7): H04R1/00; G01N29/24; G01S7/521
Domestic Patent References:
| JP3274900A | ||||
| JP58191788U |
Attorney, Agent or Firm:
Yoshiyuki Kaji