Title:
SPIN CLEANING APPARATUS OF SEMICONDUCTOR WAFER
Document Type and Number:
Japanese Patent JP3455907
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a spin cleaning device of a semiconductor wafer which enables spin cleaning, while rotating it at a high speed without enlarging the diameter of evacuation pad by preventing the outer circumferential part thereof from bending and warping even with respect to extremely thin semiconductor wafer of large diameter.
SOLUTION: The upper end part of a spin shaft (5) is provided with a vacuum suction pad (6) which fixes the lower surface central part of a semiconductor wafer (WH) through suction. An air blow-off pad (13), which supports the outer circumferential part of the semiconductor wafer (WH) loose, by blowing off air to a clearance between it and a lower surface of the semiconductor wafer (WH) which is fixed through suction to the vacuum suction pad (6), is disposed in circumference of the evacuation pad (6).
Inventors:
Tetsuo Okuyama
Shiro Murai
Kunihiro Saita
Shiro Murai
Kunihiro Saita
Application Number:
JP2000237841A
Publication Date:
October 14, 2003
Filing Date:
August 07, 2000
Export Citation:
Assignee:
Hihei Toyama Co., Ltd.
International Classes:
B08B5/02; B08B3/02; H01L21/304; (IPC1-7): H01L21/304; B08B3/02; B08B5/02
Domestic Patent References:
| JP200243400A | ||||
| JP964004A | ||||
| JP778745A | ||||
| JP373436U | ||||
| JP6232533U |
Attorney, Agent or Firm:
Michizo Isono
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