Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
SPUTTERING APPARATUS
Document Type and Number:
Japanese Patent JPH05230649
Kind Code:
A
Abstract:

PURPOSE: To optimize the distribution of target erosion after sputtering discharge, to increase the using efficiency of a target thereby and to attain the homogenization of the compsn. of a film and of the film thickness distribution.

CONSTITUTION: In an electrode of a planar magnetron type sputtering apparatus, plural concentric cylinder-shaped electromagnets are arranged at its rear face, and, in the plural concentric cylinder-shaped electromagnets, D.C. and A.C. impressed on each electromagnet are controlled by external power sources provided separately.


More Like This:
JPH07113172COLLIMATOR, DEVICE AND METHOD FOR FORMING THIN FILM, AND METHOD FOR FORMING WIRING OF SEMI-CONDUCTOR DEVICE
JPS6179767FORMATION OF FILM
JPS55141721SPUTTERING APPARATUS FOR MAGNETIC BODY
Inventors:
EJIMA MASAKI
YOSHIDA IKUO
FUKUDA KUNIO
YAMAMURA KAZUICHI
SAKAGUCHI ARATA
Application Number:
JP6921492A
Publication Date:
September 07, 1993
Filing Date:
February 18, 1992
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
SHINETSU CHEMICAL CO
International Classes:
C23C14/44; C23C14/35; H01L21/203; H01L21/285; (IPC1-7): C23C14/35; C23C14/44; H01L21/203; H01L21/285
Attorney, Agent or Firm:
Ryoichi Yamamoto (1 person outside)



 
Previous Patent: JPS5230648

Next Patent: SUBSTRATE HOLDER AND PRODUCTION THEREOF