PURPOSE: To form a film uniformly over the entire surface of a substrate surface at the time of forming this film on the surface of the substrate by an OMVPE method, vacuum vapor deposition method, sputtering method, etc.

CONSTITUTION: The entire surface of the surface of a base plate 2 is first polished to form a flat polished surface, and thereafter the same material as the material of the base plate 2 or a material having the same coefft. of thermal expansion as the coefft. of thermal expansion of the base plate is formed by a method, such as vapor deposition, sputtering or plating, on the peripheral edge of the polished surface. The substrate 5 is imposed on the polished surface in the case of formation of the film on the surface of the substrate 5. The surface 3 to be imposed with the substrate 5 is the polished surface at this time and, therefore, the surface having high flatness is obtd. The entire part of the rear surface of the substrate 5 imposed thereon is eventually brought into uniform contact with the polished surface of the substrate holder. Consequently, the substrate 5 is thermally uniformalized over the entire part thereof and the film is formed uniformly over the entire surface of the substrate surface.