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Patent Searching and Data


Title:
STRUCTURE-MANUFACTURING WIRING BODY SUBSTRATE AND MANUFACTURE THEREOF
Document Type and Number:
Japanese Patent JPH1041435
Kind Code:
A
Abstract:

To manufacture the wiring body having excellent dimensional precision and sufficient strength without contraction, at low cost by a method wherein a number of metallic fine wires are buried in parallel with the main axis in a columnar body comprising a composition made of an organic insulator as a continuous phase, and an inorganic insulator as a discontinuous phase.

A material is prepared by mixing a varnish organic insulator 12 and inorganic insulator so as to inject this prepared material in a vessel wherein metallic fine wires 14 are disposed in tension in parallel with one another through the intermediary of upper and lower wide guides to be heated for cuiring the organic insulator 12 and manufacturing the columnar body 10. Through these procedures, the thick columnar body 10 in sufficient thickness with numerous metallic fine wires 14 buried in parallel with a main axis can be manufactured so easily within a short time to greatly improve the productivity. Furthermore, the manufactured columnar body 10 is subject to almost no dimensional contraction thereby enabling the dimensional precision to be improved.


Inventors:
HORIUCHI MICHIO
MIYAGAWA HIROSHI
Application Number:
JP18919296A
Publication Date:
February 13, 1998
Filing Date:
July 18, 1996
Export Citation:
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Assignee:
SHINKO ELECTRIC IND CO
International Classes:
B29C70/58; B29C70/68; H01L23/14; H05K3/00; B29K103/04; B29K105/22; B29L31/34; (IPC1-7): H01L23/14; B29C70/58; B29C70/68; H05K3/00
Attorney, Agent or Firm:
Takao Watanuki (1 outside)