Title:
SUBSTITUTION INHIBITOR
Document Type and Number:
Japanese Patent JPS63109191
Kind Code:
A
Abstract:
PURPOSE:To prevent defective adhesion during bonding by preventing the deposition of substituted silver with a mixed aq. soln. contg. potassium phosphate and mercaptopyridine when silver is electrodeposited on copper-base stock. CONSTITUTION:This substitution inhibitor is made of a mixed aq. soln. contg. potassium phosphate and mercaptopyridine. When silver is electrodeposited on copper or copper alloy stock or copper plated stock, the substitution inhibitor is used so as to prevent the deposition of substituted silver. As a result, defective adhesion during the die or wire bonding of silicon IC chips is prevented and reliability is improved.
Inventors:
TOKI SOTARO
NOGUCHI FUMINOBU
NOGUCHI FUMINOBU
Application Number:
JP25450486A
Publication Date:
May 13, 1988
Filing Date:
October 25, 1986
Export Citation:
Assignee:
TOPPAN PRINTING CO LTD
International Classes:
C25D5/34; (IPC1-7): C25D5/34
Domestic Patent References:
| JPS5743995A | 1982-03-12 |
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