Title:
基板処理装置及び基板処理方法
Document Type and Number:
Japanese Patent JP7425175
Kind Code:
B2
Abstract:
The inventive concept provides a mask treating method. The mask treating method includes treating a mask by supplying a liquid to the mask, and irradiating a laser to a region of the mask on which a specific pattern is formed while the liquid remains on the mask; moving an optical module including a laser unit configured to irradiate the laser between a process position for treating the substrate and a standby position deviating from the process position; and adjusting a state of the optical module at an inspection port provided at the standby position to a set condition before the optical module is moved to the process position.
Inventors:
Yang, Hyo Won
Yoon, Hyun
John, Ji Hoon
Choi Ki Hung
Jun, Inki
Song, Won Shik
kim tae hee
Yoon, Hyun
John, Ji Hoon
Choi Ki Hung
Jun, Inki
Song, Won Shik
kim tae hee
Application Number:
JP2022212258A
Publication Date:
January 30, 2024
Filing Date:
December 28, 2022
Export Citation:
Assignee:
SEMES CO., LTD.
International Classes:
H01L21/027; H01L21/306
Domestic Patent References:
| JP2003282400A | ||||
| JP2001093806A | ||||
| JP11202474A | ||||
| JP63022733U |
Attorney, Agent or Firm:
IBC Ichibancho Patent Attorney Corporation
Previous Patent: Vehicle control system and control method
Next Patent: Mask processing equipment and substrate processing equipment
Next Patent: Mask processing equipment and substrate processing equipment