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Title:
基板処理装置
Document Type and Number:
Japanese Patent JP7133403
Kind Code:
B2
Abstract:
To reduce a time required for cleaning and processing a substrate.SOLUTION: A substrate processing apparatus includes a substrate holding unit, a rotation drive unit that rotates a substrate held by the substrate holding unit, a brush unit that cleans a peripheral unit of the substrate held by the substrate holding unit, and a moving unit that moves the relative position of the brush unit with respect to the substrate, and the brush unit performs cleaning by simultaneously contacting a plurality of contact units provided along the circumferential direction of the substrate at the same time with respect to the substrate.SELECTED DRAWING: Figure 3

Inventors:
Hidetaka Shinohara
Nobuhiko Mouri
Application Number:
JP2018167589A
Publication Date:
September 08, 2022
Filing Date:
September 07, 2018
Export Citation:
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Assignee:
東京エレクトロン株式会社
International Classes:
H01L21/304
Domestic Patent References:
JP2006278592A
JP2001191037A
Attorney, Agent or Firm:
Yoshiki Hasegawa
Yoshiki Kuroki
Junji Kashiwaoka
Shigeki Matsuo



 
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