Title:
SUBSTRATE PROCESSING METHOD AND AIRTIGHT SEAL METHOD FOR PACKAGE
Document Type and Number:
Japanese Patent JP2017022056
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a substrate processing method capable of uniformly processing a front face of a substrate by easily attaching/detaching a mask inside of a vacuum processing apparatus, and an airtight seal method for a package employing the substrate processing method.SOLUTION: A mask consisting of a magnetic substance is disposed on a front face of a substrate, a magnet is provided n a rear side of the substrate, the mask is held on the front face of the substrate and while holding the mask, processing such as metal deposition or sputtering is applied to the front face of the substrate within vacuum. Such a method is utilized to perform vacuum airtight sealing by joining a photoelectric conversion film glass substrate and a glass package substrate including an electron source array within high vacuum by using a metal thin film that is formed on a surface where the substrates are brought into contact with each other.SELECTED DRAWING: Figure 1
Inventors:
NANBA MASAKAZU
HONDA YUKI
HONDA YUKI
Application Number:
JP2015140752A
Publication Date:
January 26, 2017
Filing Date:
July 14, 2015
Export Citation:
Assignee:
NIPPON HOSO KYOKAI
International Classes:
H01J9/26; C23C14/04; H01J31/38; H01L23/02; H01L23/14; H01L31/02
Attorney, Agent or Firm:
Kenji Sugimura
Makoto Fukuo
Kyoichi Saito
Makoto Fukuo
Kyoichi Saito