Title:
SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS
Document Type and Number:
Japanese Patent JP2023046448
Kind Code:
A
Abstract:
To provide a substrate processing method and a substrate processing apparatus capable of accurately processing the outer peripheral edge of a substrate with a chemical solution.SOLUTION: By supplying a protective film forming liquid to a first main surface W1 of a substrate W, a protective film is formed on a first peripheral portion 110 of the substrate W (protective film forming step). By supplying an etchant to a second main surface W2 of the substrate with a polymer film 100 formed on the first peripheral portion 110, the outer peripheral edge E of the substrate W is treated with the chemical solution (first chemical solution supply step). After the first chemical solution supply step, the polymer film 100 is removed (protective film removing step).SELECTED DRAWING: Figure 6C
Inventors:
INABA MAKI
UMEDA EIJI
UMEDA EIJI
Application Number:
JP2021155043A
Publication Date:
April 05, 2023
Filing Date:
September 24, 2021
Export Citation:
Assignee:
SCREEN HOLDINGS CO LTD
International Classes:
H01L21/306; H01L21/304
Attorney, Agent or Firm:
Patent Attorney Corporation Ai Patent Office