Title:
SUBSTRATE FOR SEMICONDUCTOR PACKAGE
Document Type and Number:
Japanese Patent JP3760913
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a substrate for a semiconductor package, which can deal with reduction in the size and thickness of a package and can produce a semiconductor package, e.g. BGA or CSP, exhibiting excellent heat resistance.
SOLUTION: A wiring pattern is formed on the first adhesive material face of a double-sided adhesive material insulation film having first and second adhesive material layers wherein the thickness (T1) of the first adhesive material layer and the thickness (T2) of the second adhesive material layer are 15 μm or less, the thickness ratio (T1/T2) is in the range of 0.30-15.0, and a non- through hole for external connection is made to reach the wiring pattern from the second adhesive material layer side.
Inventors:
Yoshiaki Tsubomatsu
Fumio Inoue
Satoo Yamazaki
Hiroto Ohata
Hiroshi Nomura
Noriyuki Taguchi
Fumio Inoue
Satoo Yamazaki
Hiroto Ohata
Hiroshi Nomura
Noriyuki Taguchi
Application Number:
JP2002347629A
Publication Date:
March 29, 2006
Filing Date:
August 11, 1995
Export Citation:
Assignee:
Hitachi Chemical Co., Ltd.
International Classes:
H01L23/12; H01L23/14; (IPC1-7): H01L23/14; H01L23/12
Domestic Patent References:
| JP62114286A | ||||
| JP6112354A | ||||
| JP4277636A |
Attorney, Agent or Firm:
Tetsuo Hotaka
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