Title:
SUBSTRATE-TRANSFERRING DEVICE AND PLASMA-PROCESSING DEVICE
Document Type and Number:
Japanese Patent JPH11168129
Kind Code:
A
Abstract:
To effectively prevent the positional deviation, the falling, and damages such as cracks of a substrate.
A plurality of substrate pads 3a in contact with the lower surface of a substrate 1 and a plurality of substrate pads 3b in contact with the outer-periphery of the substrate 1 are provided inside the substrate 1, which is transferred by a substrate-transferring device for transferring the substrate 1 under reduced pressure. Furthermore, a plurality of substrate pads 3c are provided outside the substrate 1, and the substrates pads 3b and 3c are provided at a position higher than that of the substrate pad 3a and at the same time gradually at a higher position, farther, away it is from the substrate 1.
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Inventors:
WATANABE KUNIHIKO
TANAKA MASAHIRO
TORITSUKA TAKEMI
TANAKA MASAHIRO
TORITSUKA TAKEMI
Application Number:
JP33415397A
Publication Date:
June 22, 1999
Filing Date:
December 04, 1997
Export Citation:
Assignee:
HITACHI LTD
International Classes:
B65G49/00; B25J15/00; B65G49/06; B65G49/07; H01L21/677; H01L21/68; (IPC1-7): H01L21/68; B25J15/00; B65G49/00; B65G49/06; B65G49/07
Attorney, Agent or Firm:
Junnosuke Nakamura