Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
SURFACE GRINDING PROCESS
Document Type and Number:
Japanese Patent JP2004042174
Kind Code:
A
Abstract:

To improve grinding precision in a grinding process using a planar grinder, through a simple structure of the grinder.

The surface surface grinding process is a method to grind work W to obtain a specific machining allowance by revolving a grinding stone through a stone rotational electric motor 8 and moving the stone in the direction of stone core. While the rotating stone 3 is being moved toward the work in the direction of the rotational axis core of the stone after the current from the electric motor 8 is detected through a current detector, when a fixed current increase is detected from the non-load electric current value, the grinding is started, and grinding the specified machining allowance D6 is implemented with the grinding start location P3 as the basis. The fixed current increase value for determining the grinding start position is preferably set to 0.5 ampere. As a result, it is not necessary to attach any special measuring instrument or sensor, and maintenance or adjustment activities are not needed, either.


Inventors:
KOMATA KAZUHARU
Application Number:
JP2002201438A
Publication Date:
February 12, 2004
Filing Date:
July 10, 2002
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
DAISHO SEIKI CORP
International Classes:
B24B49/16; B24B7/04; (IPC1-7): B24B7/04; B24B49/16
Domestic Patent References:
JP2002028860A2002-01-29
JPH11245165A1999-09-14
JPS6434650A1989-02-06
JPH0655438A1994-03-01
JPH0929628A1997-02-04
Attorney, Agent or Firm:
Aoyama Aoi
Osamu Kawamiya
Tadataka Omori