To provide a surface mounting method of pins of a PGA package.

In the method for forming a PGA package by fitting pins in the surface of a substrate, at first, an organic layout substrate laid out with a circuit pattern and having at least one conductive pin on at least one surface is provided. An insulating protective layer is formed on the surface of the layout substrate and patterned to expose a pad and then a well is formed to surround the pad. The pin and a solder material are left as they are on the pad in the well. The protective layer does not cover any part of the pad and thereby the periphery of the pad and the air gap of the protective layer can be filled completely with the solder material. The pin is soldered onto the pad under a temperature capable of fusing the solder material and the solder material is covered fixedly with the pad thus completing the surface mounting process of the pins of a PGA package.