TERMINAL STRUCTURE OF WIRING BOARD

Title:

TERMINAL STRUCTURE OF WIRING BOARD

Document Type and Number:

Japanese Patent JP2003243559

Kind Code:

A

Abstract:

To prevent the strip of a conductive pattern or corner cracking in a wiring board.

The terminal structure of a wiring board comprises a lower layer (5) having a plurality of side through holes opening sideward, an upper layer (3) having a lower surface (3b) facing the side through hole (7) and a corner (3a), a conductive pattern (13) provided on the lower surface (3b) of the upper layer, and an electrode (11) provided on the inner wall (7w) of the side through hole and capable of conducting with the conductive pattern (13). The conductive pattern (13) is formed not to face the side through hole (7) so that a solder fillet (9) does not reach the vicinity of the corner part (3a) at the time of reflow. The strip of the conductive pattern or corner cracking due to the difference of thermal expansion coefficients between the wiring board (1) and a mother board (21) or difference of shrinkages of solder fillets at different positions can thereby be prevented.

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Inventors:

IGUCHI KOICHI
TOMITA TAKASHI
SHIMAMURA MASAYA
IMAI MASABUMI

Application Number:

JP2002087189A

Publication Date:

August 29, 2003

Filing Date:

February 19, 2002

Export Citation:

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Assignee:

TAIYO YUDEN KK

International Classes:

H01L23/12; (IPC1-7): H01L23/12

Attorney, Agent or Firm:

Nobuaki Arai

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