To improve the performance such as corrosion resistance and adhesion for a coating film characteristic of a metallic sheet without using chromium by forming a film which contains a monovalent copper compd. and does not contain chromium on the surface of a metallic sheet.
This surface treated metallic sheet is composed by forming a film which contains a monovalent copper compd. and does not contain chromium on the surface of a metallic sheet for a substrate. As the metallic sheet for a substrate, preferably, an aluminum sheet, an aluminum base alloy sheet, a galvanized steel sheet or the like is given. For forming the film on the surface of the metallic sheet for a substrate with tight adhesion, the utilization of a copper electroplating method, among which pulse electrolysis is desirable. By such method, a part or the whole of metallic copper or a copper compd. precipitated on the surface of the substrate metallic sheet is changed into a monovalent copper compd. to form a monovalent copper film. The monovalent copper compd. has chelating action, the action of forming primary bonding by the discomposition of hydrogen in the allylic position or the like, and these are thought to contribute to the improvement of the performance of the metallic sheet.
OSAKI KATSUHISA
TSUBURAYA HIROSHI
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