PURPOSE: To execute current collection from copper foil without using current collecting rolls.
CONSTITUTION: This method for surface treatment of copper foil for printed circuits comprises an in-liquid current collecting method executing the electrochemical surface treatment of the copper foil by arranging both an anode plate directly coupled to a power source in order to impress current to the copper foil and a cathode plate directly coupled to the power source in order to collect the current from the copper foil in an electrolytic bath so as to face the copper foil and impressing and collecting the required current to the copper foil without using the current collecting rolls. The anode plate 5 directly coupled to the positive pole of the DC power source 4 and the cathode plate 6 directly coupled to the negative pole of the DC power source 4 are arranged to face the copper foil in an electrolytic cell 2 for subjecting the copper foil 1 to the treatment A and an electrolytic cell 3 for subjecting the copper foil to the treatment B. Such electrochemical reaction in which the copper foil acts as the anode is established in the treatment A. Such electrochemical reaction in which the copper foil acts as the cathode is established in the treatment B. The electrolytic treatment, i.e., electrolytic polishing and electrolytic degreasing are effected in the treatment A and the electrodeposition reaction, such as surface roughening or plating, is effected in the treatment B.
ARAI EITA
KUROSAWA TOSHIO
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