Title:
SYSTEM FOR DICING WAFER BLOCK
Document Type and Number:
Japanese Patent JP3639884
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a dicing system which can precisely and efficiently execute dicing with an ordinary dicer without recognizing the shape at the time of taking out the blocks of a wafer, which are divided into more than two and are kept as stocks, later and dicing them.
SOLUTION: At the time of dividing a wafer into more than two blocks, the address of a street to be cut is recognized and block data representing to which area it belongs is generated and registered in a CPU. Identification indications are provided on the respective blocks and the identification indication are correlated with block data. For dicing the block for respective chips, block data is called based on the identification indication. Then, the division lines of the block are detected. The alignment of the chips 2 for the respective addresses of the street is recognized. Then, an optimum alignment interval and a cutting stroke are recognized. Minute alignment is executed based on the alignment interval and dicing is executed based on the cutting stroke.
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Inventors:
Kazuma Sekiya
Katsuji Negishi
Katsuji Negishi
Application Number:
JP31585995A
Publication Date:
April 20, 2005
Filing Date:
November 10, 1995
Export Citation:
Assignee:
Disco Co., Ltd.
International Classes:
H01L21/301; H01L21/02; (IPC1-7): H01L21/301; H01L21/02
Domestic Patent References:
| JP62152814A | ||||
| JP2164016A | ||||
| JP8203987A |
Attorney, Agent or Firm:
Teruo Akimoto