PURPOSE: To improve and stabilize adhesiveness between a semiconductor device and tape by burning fat and oil ingredients adhered on the semiconductor device by combustion gas at a combustion gas processing part.

CONSTITUTION: A semiconductor device 1 supplied from a semiconductor device supplying part 2 is carried to a hydrogen flame processing part 7 by a sucking jig 3. Then, the semiconductor device 1 whose fat and oil ingredients are burnt at the hydrogen flame processing part 7 is carried to a taping part 6 by the sucking jig 3 to be press-bonded with tape 4 and is stored in a tape reel 4 with the tape 4. The oil and fat ingredients adhered on the rear plane of the semiconductor device 1 which is set on a semiconductor aligning jig 8 is burned and removed by hydrogen flame 11 blowing out from a torch 10 which reciprocates horizontally. Thus, the stable semiconductor device which permits high adhesiveness with the tape is provided.