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Title:
TERMINAL BOARD MATERIAL FOR MAGNETIC HEAD ASSEMBLY, TERMINAL BOARD, AND MAGNETIC HEAD ASSEMBLY
Document Type and Number:
Japanese Patent JPH05325152
Kind Code:
A
Abstract:

PURPOSE: To enhance work efficiency by providing a terminal board material with a pattern indicating cutting positions and cutting the terminal board material with reference to the pattern thereby making it possible to cut the terminal board material positively at regular positions at all times.

CONSTITUTION: A terminal board material 69 comprises a printed wiring board in which predetermined conductor patterns of copper foil for two channels are previously provided on a common film 61. Consequently, respective terminal board sections 49A, 49B protrude in Y-shape from a marginal part 61a. The part 61a is cut off at position P. The position P lies on the border line between conductor patterns 53A, 53B and lands 53A', 53B' for checking characteristics and forms a linear cut 70 which can be recognized at a glance. For example, the film 61 (undercoat) is orange while the conductor patterns 53A, 53B and 53A', 53B' are silver because of small quantity of solder applied on copper foil. Since high contrast is realized with respect to the undercoat, the cut 70 can be recognized easily and the terminal board 49A can be manufactured with high workability.


Inventors:
YOSHIDA FUTOSHI
OOURA SEIJI
KAWAMURA KAYOKO
Application Number:
JP15573692A
Publication Date:
December 10, 1993
Filing Date:
May 22, 1992
Export Citation:
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Assignee:
SONY CORP
International Classes:
G11B5/127; G11B5/53; H05K1/02; H05K3/00; (IPC1-7): G11B5/53; G11B5/127
Attorney, Agent or Firm:
Mitsuo Takahashi