To highly accurately test high density circuit board in a short time by one operation in relation to a test head of a circuit board and a test method of the circuit board.

A head is brought into contact with points on a circuit board with a plurality of probe pins and tests electric characteristics of a network that is constituted on the circuit board. In this case, points (S1) whose distance to other point are at least a specified value, are extracted at least one from each network as first-class points, and points (S2) whose distance to other point are less than the specified value are classified every other point into the first group and the second group in a fixed sequence. Probe pins in contact with points in first-class and the first group are allocated to the first head, and probe pins in contact with points in the second group and points both in the first-class and same net as the points in the second group are allocated to the second head (S2-S8). Thereby, a test head is constituted.