Title:
THERMALLY CONDUCTIVE SHEET, CURED PRODUCT OF THERMALLY CONDUCTIVE SHEET, AND SEMICONDUCTOR DEVICE
Document Type and Number:
Japanese Patent JP2016027143
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a thermally conductive sheet and a cured product of the sheet, which exhibit an excellent balance between thermal radiation property and insulating property, and a semiconductor device having high durability.SOLUTION: The thermally conductive sheet of the present invention includes a thermosetting resin (A) and an inorganic filler (B) dispersed in the thermosetting resin (A). In the measurement of a pore diameter distribution by a mercury intrusion method for the inorganic filler (B) included in an incineration residue after a cured product of the thermally conductive sheet is heated and incinerated at 700°C for 4 hours, a pore diameter distribution curve of the inorganic filler (B), which is plotted with a pore diameter R as an abscissa and a logarithmic derivative of pore volume (dV/dlogR) as a vertical axis, has a first maximum in the range where the pore diameter R is 0.1 μm or more and 5.0 μm or less, and a second maximum in the range where the pore diameter R is 10 μm or more and 30 μm or less; and the difference between a second pore diameter at the second maximum value and a first pore diameter at the first maximum value is 9.9 μm or more and 25 μm or less.SELECTED DRAWING: None
Inventors:
MOCHIZUKI SHUNSUKE
KITAGAWA KAZUYA
SHIRATO HIROTSUGU
NAGAHASHI KEITA
TSUDA MIKA
HIRASAWA NORIYA
KUROKAWA MOTOMI
KITAGAWA KAZUYA
SHIRATO HIROTSUGU
NAGAHASHI KEITA
TSUDA MIKA
HIRASAWA NORIYA
KUROKAWA MOTOMI
Application Number:
JP2015130020A
Publication Date:
February 18, 2016
Filing Date:
June 29, 2015
Export Citation:
Assignee:
SUMITOMO BAKELITE CO
International Classes:
C08L63/00; C08K3/38; C08L79/04; H01L23/36
Domestic Patent References:
| JP2010070582A | 2010-04-02 | |||
| JP2010157563A | 2010-07-15 | |||
| JP2011176024A | 2011-09-08 | |||
| JP2012017421A | 2012-01-26 | |||
| JP2012121793A | 2012-06-28 | |||
| JP2014040341A | 2014-03-06 | |||
| JP2014040533A | 2014-03-06 |
Foreign References:
| WO2014136959A1 | 2014-09-12 | |||
| WO2013100172A1 | 2013-07-04 |
Attorney, Agent or Firm:
Shinji Hayami