Title:
THERMALLY CONDUCTIVE SHEET, CURED PRODUCT OF THERMALLY CONDUCTIVE SHEET, AND SEMICONDUCTOR DEVICE
Document Type and Number:
Japanese Patent JP2016027144
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a thermally conductive sheet and a cured product of the sheet, which exhibit an excellent balance between thermal radiation property and insulating property, and a semiconductor device having high durability.SOLUTION: The thermally conductive sheet of the present invention includes a thermosetting resin (A) and an inorganic filler (B) dispersed in the thermosetting resin (A). In the measurement of a pore diameter distribution by a mercury intrusion method for the inorganic filler (B) included in an incineration residue after a cured product of the thermally conductive sheet is heated and incinerated at 700°C for 4 hours, a pore diameter distribution curve, which is measured through the mercury intrusion technique and is plotted with a pore diameter R as an abscissa and a logarithmic derivative of a pore volume (dV/d log R) as a vertical axis, has a peak (P) in the range where the pore diameter R is 1.0 μm or more and 10.0 μm or less; the peak (P) consists of two or more overlapping peaks.SELECTED DRAWING: None
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Inventors:
MOCHIZUKI SHUNSUKE
KITAGAWA KAZUYA
SHIRATO HIROTSUGU
NAGAHASHI KEITA
TSUDA MIKA
HIRASAWA NORIYA
KUROKAWA MOTOMI
KITAGAWA KAZUYA
SHIRATO HIROTSUGU
NAGAHASHI KEITA
TSUDA MIKA
HIRASAWA NORIYA
KUROKAWA MOTOMI
Application Number:
JP2015130021A
Publication Date:
February 18, 2016
Filing Date:
June 29, 2015
Export Citation:
Assignee:
SUMITOMO BAKELITE CO
International Classes:
C08L101/00; C08K3/00; C08L63/00; C08L79/00; H01L23/36
Domestic Patent References:
| JP2010157563A | 2010-07-15 | |||
| JP2014040533A | 2014-03-06 | |||
| JP2013048257A | 2013-03-07 | |||
| JP2003306594A | 2003-10-31 |
Foreign References:
| WO2014136959A1 | 2014-09-12 |
Attorney, Agent or Firm:
Shinji Hayami