Title:
THERMOELEMENT MODULE, PACKAGE STORING SEMICONDUCTOR ELEMENT AND SEMICONDUCTOR MODULE
Document Type and Number:
Japanese Patent JP3909253
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To solve a problem that thermal stress is concentrated on solder between the thermoelement of a thermoelement module and a metallic member, that a crack occurs and the capacity of the thermoelement module and that of a semiconductor module using the module drop.
SOLUTION: In the thermoelement module 10, both ends of a plurality of thermoelements 1 are bonded to a pair of insulating substrates 2 through the metallic members 5, and the semiconductor element is mounted on one insulating substrate 2. The metallic member 5 abuts on the end face of the thermoelement 1 at a protrusion 5a whose area is smaller than the end face. The storage part of solder 3 is formed between the periphery of the protrusion 5a and the end face of the thermoelement 1 facing the periphery and is bonded to the insulating substrate 2 through solder 4. An end face opposite to the protrusion 5a abuts on the base of a recess 2a whose area is larger than the end face formed in the insulating substrate 2. The storage part of solder 4 is formed between the inner face of the recess 2a and the outer face of the end of the metallic member 5 facing the inner face.
Inventors:
Ryuji Mori
Application Number:
JP2002041650A
Publication Date:
April 25, 2007
Filing Date:
February 19, 2002
Export Citation:
Assignee:
Kyocera Corporation
International Classes:
H01L23/34; H01L35/32; H01L23/38; H01L35/08; H01L35/14; H01L35/16; H01L35/18; H01S5/024; (IPC1-7): H01L35/32; H01L23/34; H01L23/38; H01L35/08; H01L35/14; H01L35/16; H01L35/18; H01S5/024
Domestic Patent References:
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| JP2001102643A | ||||
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